High-Lead solder paste of Semiconductor

High lead, high melting point alloys, lead content is more than 85%. Can meet the ROHS directive. Usually used in package of power semiconductor device , can Miscibility with Au,Cu,Ag,high residual impedance and good welding strength.

Packaging: 35g is 10CC syringes, 100gis 30CC syringes, 500g is standard bottled ,
1000g is bottled or syringes.

Sales:panda
Mob:13418541881
Tel:0755-33019826
Fax:0755-33010398
Skype:panda-yan
MSN:xylovewyf@hotmail.com
High-Lead solder paste of Semiconductor