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shenzhen earlysun technology co,ltd
At present, solder balls
 
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Solder ball

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Title： Solder ball 
Unit price： Negotiable
MOQ： Negotiable
Quantity： Negotiable
Delivery date： Since the payment date Days delivery
Contact： Mrs. xiongyan （Mr.）    
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Details
1000, 500 and 250 thousand Tablets/bottle

Pure metal, High-ball rate , used in BGA chip package, usually used with flux.





Sales:panda
Mob:13418541881
Tel:0755-33019826
Fax:0755-33010398
Skype:panda-yan
MSN:xylovewyf@hotmail.com
Web:www.earlysun.com.cn
Solder ball
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